8" - 3M 3762LMQ Low-Melt Glue Sticks
Low-melt is applied at 265° F. to bond heat sensitive substrates such as polystyrene foam.
- Excellent "hot-tack" when dispensed at low-melt temperatures.
- Can bond expanded polystyrene, corrugated packaging and displays.
- 25 second bonding range.
- FDA listed.